Detailed introduction/parameters/applications/functions/maintenance of Aluminium Nitride Heating plates

　　▼Key Advantages:

　　Ultra-High Thermal Conductivity:AlN ceramic offers exceptional thermal conductivity (theoretical value ~320 W/mK, practical: 170–220 W/mK), far exceeding alumina ceramics. This enables rapid, uniform heat transfer from heating elements (e.g., resistor circuits) to target surfaces, minimizing thermal stress while improving efficiency and temperature uniformity.

　　Excellent Electrical Insulation:High insulation strength and resistivity ensure safety, especially in high-voltage or electrically isolated applications.

　　Low Thermal Expansion Coefficient:Matches silicon chips (semiconductors), providing reliable thermal compatibility when heating/controlling temperature for semiconductor devices (e.g., IGBTs, lasers).

　　High Mechanical Strength & Hardness:Delivers robust structural support and durability.

　　High-Temperature & Corrosion Resistance:Stable performance in high temperatures (>800°C long-term) and harsh chemical environments.

　　Low Dielectric Constant/Loss:Ideal for high-frequency applications.

　　▼Typical Applications:

　　1.Semiconductor Manufacturing & Testing:Wafer chucks, probe station hot plates, package testing.

　　2.Thermal Management for High-Power Electronics:Heat-spreading substrates for IGBT modules, laser diodes (LD), and high-power LEDs (often with integrated thin/thick-film heating circuits).

　　3.Precision Instruments:Equipment requiring fast, uniform, stable heating (e.g., analytical instruments, vacuum components).

　　4.High-Temperature Sensor Packaging Bases.